News

Semitool’s Advanced Electroplating Tool Is Adopted by Semiconductor Packager Unitive

KALISPELL, Mont.–(BUSINESS WIRE)–July 2, 2002– Semitool, Inc. (Nasdaq:SMTL – News) today announced the delivery of its first
Advanced Packaging Platform, the APx, the latest addition to its electroplating system product line, to Unitive, Inc., of Research Triangle
Park, North Carolina, a leading provider of wafer level packaging solutions.

Semitool’s Advanced Packaging Platform (APx) Gives Unitive Leadership In Solder Electroplated
Interconnect Technology

The APx represents Semitool’s latest development for the expanding Wafer Level Packaging market. The APx’s development was
prompted by the critical industry need to reduce packaging costs while providing sufficient flexibility for advances in next generation
devices.

"Semitool’s APx streamlines wafer-level processing and equips Unitive with the solutions needed to further improve manufacturing
efficiencies," said Robert Lanzone, vice president of marketing for Unitive’s worldwide global service organization." The use of this tool will
further solidify our position as a leading volume manufacturer and technology leader."

Paul Siblerud, general manager for Semitool’s packaging division, said, "Electroplating is the deposition method of choice for solder wafer
level packaging. Our development of the APx incorporates the latest plating technology and is designed specifically for the cost sensitive
packaging market. The APx ‘s open design and small tool philosophy nicely match the need for advanced technology in an affordable
package."

APx offers several innovations that make it very user-friendly. The tool features a smaller, more open design to enable better visibility
during wafer processing. The APx ‘s eight processing chambers are arranged across the front of the tool, allowing the robot to operate
simultaneously in automated or manual mode, as well as allowing for multiple substrate sizes. The APX facilitates rapid prototyping and
analysis by supplying multiple electrolytes for metal and alloy plating, and etch and stripping chemistries. In addition, the tool has been
designed with an open design of the chemistry deck, which allows easy access for the packaging engineer and service personnel.

Safe Harbor Statement

Except for historical information, the matters discussed in this news release include forward-looking statements, within the meaning of
Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. These
include, statements relating to (i) the expanding wafer level processing market, (ii) the APx’s wafer level processing and ability to further
reduce costs, (iii) industry acceptance of electroplating for solder wafer level packaging, (iv) Unitive’s position as a leading volume
manufacturer and technology leader, (v) the APx’s ability to match the need for advanced technology affordably, and (vi) the APx’s
facilitation of prototyping and analysis. Semitool’s business in general is subject to certain risks and uncertainties that could cause actual
results to materially differ from those projected in such forward-looking statements, including, but not limited to, rapid technological
change that would render Semitool’s electroplating technology obsolete, the introduction of competing products and technologies,
particularly in the electroplating area, and market non-acceptance of Semitool’s new products, the APx’s expected cost reductions not
materializing because of unanticipated direct and indirect costs, and new applications for existing products, as well as, other risk factors related to our business
contained in the company’s Annual Report on Form 10-K for the fiscal year ended September 30, 2001 and other filings with the Securities and Exchange Commission.
The company assumes no obligation to update or supplement forward-looking statements that become untrue because of subsequent events.

About Semitool, Inc.

Semitool is a worldwide leader in the design, development, manufacture, and support of high performance, single-wafer and multi-wafer batch wet chemical processing
systems for use in the fabrication of semiconductor devices. The company’s primary suites of equipment include electrochemical deposition systems for electroplating
copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems. The
company’s equipment is used in semiconductor fabrication front-end and back-end processes, including wafer level packaging.

Headquartered in Kalispell, Montana, Semitool maintains sales and support centers in the United States, Europe and Asia. The company’s stock trades on the Nasdaq
National Market under the symbol SMTL. For more information, please visit the company’s website at http://www.semitool.com.

Semitool is a registered trademark of Semitool, Inc.

About Unitive, Inc.

Unitive is the leading provider of wafer-level packaging solutions that make semiconductors smaller, faster and lighter. Two manufacturing factories are located in N.C.,
USA and Taiwan. The company partners with its customers to meet their product and global manufacturing needs through innovative deployment of its technologies,
resulting in quicker time-to-market and lower costs. Unitive’s services include multi-level passivation and thin film wiring, solder bumping, and chip scale packaging. The
company’s strategic investors include leading financial and industry pioneers such as Onex, Celestica, Flextronics, Fairchild Semiconductor, Conexant Systems and
Wah Lee. For more information, please visit http://www.unitive.com.

Contact:

Semitool, Inc.
Paul Siblerud, 406/752-2107
[email protected]
or
Investor Relations Partners, Inc.
Darlene Hershey, 973/535-8389
[email protected]
or
Unitive Contacts:
Unitive, Inc.
Robert Lanzone, 919/941-0606, ext. 132
[email protected]
or
The Ruth Group
David Pasquale, 646/536-7006
[email protected]

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